Cadence应用案例 | 汽车行业 ECU产品中的进阶设计技巧与系统分析

● Cadence提供的PCB和封装设计以及分析解决方案，可以使设计简化

● Cadence系统分析解决方案提供高精度电磁分析、热分析和RF模拟分析，以确保系统在各种操作条件下正常运行。

ECU PCB Design

使用Cadence Allegro®工具设计PCB时，采用细线条多层基板、盲孔和埋孔、微气孔、基板嵌入的无源和有源元件，以及可折叠并安装到针对特定目标的汽车外壳中的刚挠基板进行小型化设计，这些基板针对的是车内特定的空隙和空间。Allegro与机械CAD（MCAD）工具的紧密集成，以确保外壳和PCB的生产性ECU协同设计。

Cadence PSpice® Advanced Analysis Option通过使用Smoke分析或通过Monte Carlo分析观察组件产量来确定哪些组件压力过大，从而防止电路板故障。

ECU SiP Design

Electronic control units (ECUs) for advanced driver assistance system (ADAS) applications often need multiple sensors to act as the eyes and ears of the car. The integration of these sensors with local compute for sensor fusion is a similar challenge to the integration of multiple inertial sensor die for the smartphone market. Here, SiPs provide a solution that minimizes space, weight, power, and volume costs. The small form factors and profiles of SiP solutions enable OEMs to more discreetly integrate smart sensors into the exterior surfaces of the car.

These same benefits can be achieved with any automotive ECU. The bill of materials (BoM), size, weight, and power of the ECU can all be reduced by integrating multiple bare dies and passives directly into the SiP.

Cadence SiP Layout XL is the physical design solution for advanced SiP packages, covering side-by-side die, stacked die, and combinations of the two. It supports design across a wide range of single- and multi-die packaging technologies, including laminate build-up substrates, interposers, and wafer-level fan-out packages. Its 3D-aware design and 3D visualization combines with comprehensive DFM/DFA checking to ensure accurate and efficient implementation of ECU modules and other automotive packaging applications.

Benefits:

● Comprehensive 3D checking and visualization for error-free, complex, multi-tier wirebond, flipchip, and through-silicon-via configurations

● Constraint-driven layout with auto-interactive routing technologies for fast, accurate implementation of high-density SIP interconnects

● Design tool compatibility with OSAT providers for seamless bi-directional exchange of design data

System Analysis

ECU RF Design and Analysis

Integrated RF design for radar sensors, car radio, antenna modules, and V2X ECUs can be achieved in PCB, SiP, and SoC fabrics using RF variants of Cadence design tools, with system verification achieved through Allegro Sigrity™ extraction and with Spectre® RF simulation.

Our RF/microwave design tools such as the Cadence AWR Design Environment®, AWR® Microwave Office®, and AWR Visual System Simulator™ (VSS) software address electrical/physical co-design through RF-aware device models and electromagnetic (EM) analysis along with specialized circuit simulation technology.

Benefits:

● Allegro tools for PCB antenna design and other RF copper shape editing, placement, and routing, including a library of more than 200 RF symbols

● Cadence SiP Layout XL for embedding inductors / passives in the SiP substrate

● Cadence Virtuoso® tools for closely coupled RF circuit design and RF layout for SoCs

● Spectre RF for RF system simulation, utilizing SoC/SiP inductor and packaging S-parameter models extracted with Allegro Sigrity tools

ECU Signal, Power, and Thermal Integrity Analysis

Automotive ECUs created with PCB, SiP, and SoC fabrics must accommodate harsh thermal and electromagnetic operating conditions within a car. With inter- and intra-ECU data rates also rising dramatically, this demands careful signal, power, and thermal integrity analysis. Gigahertz communications between memory and CPU in SiP and PCB designs within an ECU, or network communication between ECUs, all benefit from signal integrity (SI) analysis with the Allegro Sigrity SI Solution, where signal, power, and ground can be coupled and simulated together.

The full-wave extraction of SiP package, PCB, and connector physical contexts with the Cadence Sigrity PowerSI® 3D EM Extraction Option allows detailed analysis of the losses, reflections, ringing, and crosstalk that can impact eye openings in these high-speed ECU communication pathways.

Thermal analysis of PCBs and SiPs within the ECU can be achieved with the Cadence Sigrity PowerDC™ tool, which identifies areas of excess current density and thermal hotspots to reduce risk of field failure. Near-field emissions from ECU boards are also available from Sigrity power-aware SI analysis, as part of electro-magnetic compliance (EMC) testing.

Benefits:

● Sigrity solutions target complete power-delivery system analyses across chips, packages, and boards within an ECU

● Sigrity solutions target SI analysis for ECUs, including simultaneous switching noise (SSN) analysis of high-speed signal transmissions

● Constraint-driven design methodology ensures electrical design intent is followed and performance verified with power-aware SI analysis technology

Cadence Clarity™ 3D Solver is a 3D electromagnetic (EM) simulation tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs.

The Cadence Celsius™ Thermal Solver is the industry’s first complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures.